Jun 6, 2017. Design Guide for the Packaging of High Speed. Electronic. High Temperature Printed Board Flatness Guideline. AJ-820A. 9202. A-610F- . 6 mars 2015. IPC-2141 Design Guide for High-Speed Controlled Impedance Circuit Boards. 4. IPC-2251 Design. IPC-TM-650 Test Methods Manual. 33. Jul 12, 2012. High Area Ratio Solder Paste Release. Instructional Professor, Thayer School of Engineering. Dartmouth College. Director, Cook .